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  october 2006 rev 2 1/16 16 std50n03l STD50N03L-1 n-channel 30v - 9.2m ? - 40a - dpak/ipak stripfet? iii power mosfet general features r ds(on) *q g industry?s benchmark conduction losses reduced switching losses reduced low threshold device description this product utilizes the latest advanced design rules of st?s proprietary stripfet? technology. this is suitable for the most demanding dc-dc converter application where high efficiency is to be achieved. applications switching applications internal schematic diagram type v dss r ds(on) i d std50n03l STD50N03L-1 30v 30v 10.5m ? 10.5m ? 40a 40a ipak dpak 3 2 1 1 3 www.st.com order codes part number marking package packaging std50n03l d50n03l dpak tape & reel STD50N03L-1 d50n03l ipak tube
contents std50n03l - STD50N03L-1 2/16 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
std50n03l - STD50N03L-1 electrical ratings 3/16 1 electrical ratings table 1. absolute maximum ratings symbol parameter value unit v ds drain-source voltage (v gs = 0) 30 v v gs gate-source voltage 20 v i d (1) 1. limited by wire bonding drain current (continuous) at t c = 25c 40 a i d drain current (continuous) at t c =100c 36 a i dm (2) 2. pulse width limited by safe operating area drain current (pulsed) 160 a p tot total dissipation at t c = 25c 60 w derating factor 0.4 w/c e as (3) 3. starting t j = 25c, i d =20a, v dd =15v single pulse avalanche energy 230 mj t j t stg operating junction temperature storage temperature -55 to 175 c table 2. thermal data symbol parameter value unit r thj-case thermal resistance junction-case max 2.5 c/w r thj-amb thermal resistance junction-ambient max 100 c/w t j maximum lead temperature for soldering purpose 275 c
electrical characteristics std50n03l - STD50N03L-1 4/16 2 electrical characteristics (t case =25c unless otherwise specified) table 3. on/off states symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 a, v gs = 0 30 v i dss zero gate voltage drain current (v gs = 0) v ds = 30v v ds = 30v, tc=125c 1 10 a a i gss gate body leakage current (v ds = 0) v gs = 20v 100 na v gs(th) gate threshold voltage v ds = v gs , i d = 250a 1v r ds(on) static drain-source on resistance v gs = 10v, i d = 20a v gs = 5v, i d = 20a 9.2 0.012 10.5 0.019 m ? ? table 4. dynamic symbol parameter test conditions min. typ. max. unit c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds =25v, f=1mhz, v gs =0 1434 294 48 pf pf pf q g q gs q gd total gate charge gate-source charge gate-drain charge v dd = 15v, i d = 40a v gs = 5v (see figure 13) 10.4 5.1 3.7 14 nc nc nc q oss (1) 1. q oss =c oss *d v in ; c oss = c gd + c gd . see appendix a output charge v ds = 24v ; v gs =0 12.6 nc r g gate input resistance f=1mhz gate bias bias=0 test signal level=20mv open drain 1.1 ?
std50n03l - STD50N03L-1 electrical characteristics 5/16 table 5. switching times symbol parameter test conditions min. typ. max. unit t d(on) t r turn-on delay time rise time v dd =15v, i d = 25a, r g = 4.7 ?, v gs = 4.5v (see figure 12) 15 125 ns ns t d(off) t f turn-off delay time fall time v dd = 15v, i d = 25a, r g = 4.7 ?, v gs = 4.5v (see figure 12) 14 45 ns ns table 6. source drain diode symbol parameter test conditions min. typ. max. unit i sd i sdm (1) 1. pulse width limited by safe operating area source-drain current source-drain current (pulsed) 40 160 a a v sd (2) 2. pulsed: pulse duration=300s, duty cycle 1.5% forward on voltage i sd = 20a, v gs =0 1.3 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 40a, di/dt = 100a/s, v dd = 10 v, tj = 25c (see figure 17) 26 15.6 1.2 ns nc a t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 40a, di/dt = 100a/s, v dd = 10v, tj= 150c (see figure 17) 26.4 18.1 1.4 ns nc a
electrical characteristics std50n03l - STD50N03L-1 6/16 2.1 electrical characteri stics (curves) figure 1. safe operating area figure 2. thermal impedance figure 3. output characteristics figure 4. transfer characteristics figure 5. normalized b vdss vs temperature figure 6. static drain-source on resistance
std50n03l - STD50N03L-1 electrical characteristics 7/16 figure 7. gate charge vs gate-source voltage figure 8. capacitance variations figure 9. normalized gate threshold voltage vs temperature figure 10. normalized on resistance vs temperature figure 11. source-drain diode forward characteristics
test circuit std50n03l - STD50N03L-1 8/16 3 test circuit figure 12. switching times test circuit for resistive load figure 13. gate charge test circuit figure 14. test circuit for inductive load switching and diode recovery times figure 15. unclamped inductive load test circuit figure 16. unclamped inductive wavefo rm figure 17. switching time waveform
std50n03l - STD50N03L-1 buck converter 9/16 appendix a buck converter the power losses associated with the fets in a synchronous buck converter can be estimated using the equations shown in the table below. the formulas give a good approximation, for the sake of performance comparison, of how different pairs of devices affect the converter efficiency. however a very important parameter, the working temperature, is not considered. the real device behavior is really dependent on how the heat generated inside the devices is removed to allow for a safer working junction temperature. the low side (sw2) device requires: very low r ds(on) to reduce conduction losses small qgls to reduce the gate charge losses small coss to reduce losses due to output capacitance small qrr to reduce losses on sw1 during its turn-on the cgd/cgs ratio lower than vth/vgg ratio especially with low drain to source voltage to avoid the cross conduction phenomenon; the high side (sw1) device requires: small rg and ls to allow higher gate current peak and to limit the voltage feedback on the gate small qg to have a faster commutation and to reduce gate charge losses low r ds(on) to reduce the conduction losses. figure 18. power losses estimation
buck converter std50n03l - STD50N03L-1 10/16 table 7. power losses high side switching (sw1) low side switch (sw2) p conduction p switching zero voltage switching p diode recovery (1) not applicable conduction not applicable p gate (q g ) p qoss 1. dissipated by sw1 during turn-on table 8. paramiters meaning parameter meaning d duty-cycle q gsth post threshold gate charge q gls third quadrant gate charge p conduction on state losses p switching on-off transition losses p diode conduction and reverse recovery diode losses p gate gate drive losses p qoss output capacitance losses * i * r 2 l ds(on)sw1 ) 1 ( * i * r 2 l ds(on)sw2 ? g l i i * f * ) q (q * v gd(sw1) gsth(sw1) in + f * q * v rr(sw2) in f * t * i * v deadtime l f(sw2) f * v * q gg g(sw1) f * v * q gg gls(sw2) 2 f * q * v oss(sw1) in 2 f * q * v oss(sw2) in
std50n03l - STD50N03L-1 package mechanical data 11/16 4 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect . the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at : www.st.com
package mechanical data std50n03l - STD50N03L-1 12/16 dim. mm inch min. typ. max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a3 0.7 1.3 0.027 0.051 b 0.64 0.9 0.025 0.031 b2 5.2 5.4 0.204 0.212 b3 0.85 0.033 b5 0.3 0.012 b6 0.95 0.037 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 e 6.4 6.6 0.252 0.260 g 4.4 4.6 0.173 0.181 h 15.9 16.3 0.626 0.641 l 9 9.4 0.354 0.370 l1 0.8 1.2 0.031 0.047 l2 0.8 1 0.031 0.039 a c2 c a3 h a1 d l l2 l1 1 3 = = b3 b b6 b2 e g = = = = b5 2 to-251 (ipak) mechanical data 0068771-e
std50n03l - STD50N03L-1 package mechanical data 13/16 dim. mm. inch min. typ max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.9 0.025 0.035 b4 5.2 5.4 0.204 0.212 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 d1 5.1 0.200 e 6.4 6.6 0.252 0.260 e1 4.7 0.185 e 2.28 0.090 e1 4.4 4.6 0.173 0.181 h 9.35 10.1 0.368 0.397 l 1 0.039 (l1) 2.8 0.110 l2 0.8 0.031 l4 0.6 1 0.023 0.039 r 0.2 0.008 v2 0 8 0 8 dpak mechanical data 0068772-f
packaging mechanical data std50n03l - STD50N03L-1 14/16 5 packaging mechanical data tape and reel shipment dpak footprint dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0.795 g 16.4 18.4 0.645 0.724 n 50 1.968 t 22.4 0.881 base qty bulk qty 2500 2500 reel mechanical data dim. mm inch min. max. min. max. a0 6.8 7 0.267 0.275 b0 10.4 10.6 0.409 0.417 b1 12.1 0.476 d 1.5 1.6 0.059 0.063 d1 1.5 0.059 e 1.65 1.85 0.065 0.073 f 7.4 7.6 0.291 0.299 k0 2.55 2.75 0.100 0.108 p0 3.9 4.1 0.153 0.161 p1 7.9 8.1 0.311 0.319 p2 1.9 2.1 0.075 0.082 r 40 1.574 w 15.7 16.3 0.618 0.641 tape mechanical data all dimensions are in millimeters
std50n03l - STD50N03L-1 revision history 15/16 6 revision history table 9. revision history date revision changes 31-jul-2006 1 initial release. 27-oct-2006 2 modified figure 1.: safe operating area on page 6
std50n03l - STD50N03L-1 16/16 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2006 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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